Three-dimensional package structure and the method to fabricate thereof

ABSTRACT

The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication No. 61/918,684 filed on Dec. 20, 2013, which is herebyincorporated by reference herein and made a part of specification.

BACKGROUND OF THE INVENTION

I. Field of the Invention

The present invention relates to a package structure, and inparticularly, to a three-dimensional package structure.

II. Description of the Prior Art

Electronic package structures are formed by complicated packageprocesses. Different electronic package structures have differentelectrical performances and capacities of heat dissipation, andtherefore a designer may select an electronic package structure with adesired electrical performance and capacity of heat dissipationaccording to a design requirement.

FIG. 1 is a schematic diagram of a conventional electronic packagestructure. Referring to FIG. 1, the conventional electronic packagestructure 100 includes a printed circuit board (PCB) 110 and a pluralityof electronic elements 120. The electronic elements 120 are disposed ona surface 112 of the PCB 110 and electrically connected to the PCB 110.The PCB 110 has a plurality of pins 116 extending out from anothersurface 114 of the PCB 110 to be electrically connected to an electronicdevice, for example, a motherboard (not shown).

FIG. 2 is a schematic diagram of another conventional electronic packagestructure. Referring to FIG. 2, the conventional electronic packagestructure 200 includes a circuit substrate 210 and a plurality ofelectronic elements 220. The electronic elements 220 are disposed on asurface 212 of the circuit substrate 210, and electrically connected tothe circuit substrate 210 via a wire bonding technology, a flip-chipbonding technology or a surface mount technology. Moreover, theconventional electronic package structure 200 may be electricallyconnected to an electronic device, for example, a motherboard (notshown), via a solder paste or a plurality of solder balls (not shown).

It should be noted that the electronic elements 120 of the conventionalelectronic package structure 100 are all disposed on the surface 112 ofthe PCB 110, and the electronic elements 220 of the conventionalelectronic package structure 200 are all disposed on the surface 212 ofthe circuit substrate 210. Therefore, in the conventional electronicpackage structures 100 and 200, spatial utilization of the PCB 110 andthe circuit substrate 210 is relatively low, and the sizes of theconventional electronic package structures 100 and 200 are relativelylarge.

Conventionally, SIP (Single Inline Package), LGA (Land Grid Array) andBGA (Ball Grid Array) are widely used in package structures, such as thepackage structures of power element/modules like DC/DC converter for PC,Notebook, Servo . . . , etc. However, SIP requires soldering, large areaand manual disposing; LGA and BGA require soldering for the electricalconnections of internal elements. Therefore, such kinds of packaginghave many disadvantages including: higher costs (large area and/ormanually disposing, soldering), lower reliability (solder melting), andpoor heat dissipation.

Accordingly, the present invention proposes a package structure and itsmanufacturing method to overcome the above-mentioned disadvantages.

SUMMARY OF THE INVENTION

One objective of the present invention is to provide a three-dimensionalpackage structure to reduce the size of an electronic module.

In one embodiment, a three-dimensional package structure is disclosed,the three-dimensional package structure comprising: a first electroniccomponent having a top surface and a bottom surface; a plurality ofsecond electronic components, disposed over the top surface of the firstelectronic component; a connecting structure disposed over the topsurface of the first electronic component for encapsulating theplurality of second electronic components, the connecting structurecomprising at least one insulting layer and a plurality of conductivepatterns separated by the at least one insulting layer, wherein theplurality of conductive patterns are disposed over the plurality of thesecond electronic components for electrically connecting the pluralityof second electronic components and the first electronic component.

In one embodiment, an insulating layer is disposed on the firstelectronic component so as to form a substantial horizontal surface overthe second electronic components, wherein said a plurality of conductivepatterns is disposed on the substantial horizontal surface. In oneembodiment, at least one terminal of the second electronic components isdisposed on the substantial horizontal surface.

In one embodiment, the top surface of the first electronic componentcomprises a cavity, wherein at least one of the plurality of secondelectronic components is disposed in the cavity. Therefore the space inthe three-dimensional package structure can be used more efficientlycompared with the conventional electronic package structures.

In one embodiment, the plurality of second electronic componentscomprises at least one of capacitor, resistor, diode, MOSFET, a baredie, and an IC.

In one embodiment, the first electronic component can be a discreteelectronic component; the discrete electronic component can be aninductor or any other electronic component (e.g., capacitor); theinductor can be a LTCC (Low Temperature Co-fired Ceramics) inductor.

In one embodiment, the plurality of second electronic componentscomprises at least one power module.

In one embodiment, further comprising at least one second electroniccomponents disposed aside the first electronic component.

In one embodiment of the present invention, the plurality of conductivepatterns further comprises a shielding layer.

In one embodiment, the at least one insulting layer comprises an ABF(Ajinomoto Build-up Film).

In one embodiment, an EMC (Epoxy Molding Compound) is disposed on thetop surface of the first electronic component, wherein the plurality ofsecond electronic components and at least one of the plurality ofconductive patterns are disposed on the EMC layer.

In one embodiment, the plurality of conductive patterns is made bylithographic thin film process.

In one embodiment of the present invention is to provide a method ofmanufacturing a three-dimensional package structure. The methodcomprises the steps of: (a) providing a first electronic componenthaving a top surface and a bottom surface; (b) disposing a plurality ofsecond electronic components over the top surface of the firstelectronic component; and (c) forming a plurality of conductive patternsover the plurality of the second electronic components to electricallyconnect the plurality of second electronic components and the firstelectronic component.

In one embodiment of the present invention is to provide a method ofmanufacturing a plurality of three-dimensional packaging module, themethod comprising the steps of: (a) providing a plurality of firstelectronic components on a carrier, wherein each of the plurality offirst electronic components has a top surface and a bottom surface; (b)disposing a plurality of second electronic components over the topsurface of each of the plurality of the first electronic components; (c)forming a plurality of conductive patterns over the plurality of secondelectronic components on each of the plurality of first electroniccomponent to electrically connect the plurality of second electroniccomponents and the first electronic component; and (d) forming theplurality of the three-dimensional packaging module, wherein eachthree-dimensional packaging module comprises a corresponding firstelectronic component and the plurality of the second electroniccomponents disposed on the corresponding first electronic component,respectively.

The detailed technology and above preferred embodiments implemented forthe present invention are described in the following paragraphsaccompanying the appended drawings for people skilled in this field towell appreciate the features of the claimed invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the accompanying advantages of thisinvention will become more readily appreciated as the same becomesbetter understood by reference to the following detailed descriptionwhen taken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic diagram of a conventional electronic packagestructure.

FIG. 2 is a schematic diagram of another conventional electronic packagestructure.

FIG. 3 a and FIG. 3 b illustrate a schematic diagram of athree-dimensional package structure according to a first embodiment ofthe present invention.

FIG. 3 c to FIG. 3 e illustrate a schematic diagram of anotherthree-dimensional package structure.

FIG. 4 a to FIG. 4 c illustrate the method and manufacturing process fora three-dimensional package structure according to a first embodiment ofthe present invention.

FIG. 5 a to FIG. 5 c illustrate the method and manufacturing process fora three-dimensional package structure according to a second embodimentof the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The detailed explanation of the present invention is described asfollowing. The described preferred embodiments are presented forpurposes of illustrations and description, and they are not intended tolimit the scope of the present invention.

The following embodiments disclose a three-dimensional packaging moduleand a method for manufacturing the three-dimensional packaging module. Athree-dimensional packaging means a packaging structure on whichconductive elements are constructed not only in plane but also stackedin height to improve the spatial efficiency.

First Embodiment

In one embodiment of the present invention, a three-dimensional packagestructure is disclosed, three-dimensional package structure comprising:a first electronic component having a top surface and a bottom surface;a plurality of second electronic components, disposed over the topsurface of the first electronic component; a connecting structuredisposed over the top surface of the first electronic component forencapsulating the plurality of second electronic components, theconnecting structure comprising at least one insulting layer and aplurality of conductive patterns separated by the at least one insultinglayer, wherein the plurality of conductive patterns are disposed overthe plurality of second electronic components for electricallyconnecting the plurality of second electronic components and the firstelectronic component.

FIG. 3 a and FIG. 3 b show the schematic diagrams of a three-dimensionalpackage structure according to a first embodiment of the presentinvention. Referring to FIG. 3 a and FIG. 3 b, the three-dimensionalpackage structure 300 includes a connecting structure 330 disposed overthe top surface of a first electronic component 320 for encapsulatingthe plurality of second electronic components 310; the first electroniccomponent 320 has a top surface 320 a and a bottom surface 320 b; theplurality of second electronic components 310 (three electroniccomponents are illustrated in FIG. 3 a and FIG. 3 b) disposed over thetop surface 320 a of the first electronic component 320; a plurality ofconductive patterns, such as the plurality of via holes 331 and wirelayer 332, are disposed over the plurality of second electroniccomponents 310 to electrically connect the plurality of secondelectronic components 310 and the first electronic component 320. In oneembodiment, at least two of the plurality of second electroniccomponents 310 are electrically connected through the plurality ofconductive patterns, such as the plurality of via holes 331 and wirelayer 332. In other words, the connecting structure 330 is disposed overthe top surface of the first electronic component to encapsulate theplurality of second electronic components, wherein the connectingstructure 330 comprises conductive patterns, such as the plurality ofvia holes 331 and wire layer 332, to electrically connect the pluralityof second electronic components 310 and the first electronic component320, wherein at least one insulting layer, such as ABF (AjinomotoBuild-up Film) 333, is used to separate the plurality of conductivepatterns. In one embodiment, the ABF (Ajinomoto Build-up Film) 333 isattached to the top surface of the first electronic component 320 bypressing to encapsulate the plurality of second electronic components310. Please note that other insulating materials can be used instead ofthe ABF (Ajinomoto Build-up Film) 333, and different layers may containdifferent insulating materials.

The conductive patterns can be formed by any suitable patterning process(e.g., lithography process). The conductive patterns can include somepads on the top surface of the connecting structure for connecting toother circuits. The conductive patterns connects at least one terminalthe second electronic components 310 to a pad on the top surface of thethree-dimensional package structure 300 for connecting to an externalcircuit, such as a PCB board. In one embodiment, one or more terminalsof each of the second electronic components 310 are disposed on the topsurface of the corresponding electronic component. In other words, allor a portion of the terminals of each second electronic components 310faces the PCB board.

In one embodiment, an insulating layer is disposed on the firstelectronic component 320 so as to form a substantial horizontal surfaceover the second electronic components 310, wherein the conductivepatterns are disposed on the substantial horizontal surface.

The projecting area on the circuit substrate of the second electroniccomponents 310 can be smaller than that of the first electroniccomponent 320 for convenience to apply patterning process over thesecond electronic components 310. Preferably, at least one terminal ofthe first electronic component 320 and at least one terminal of thesecond electronic components 310 face the circuit substrate and areelectrically connected to the circuit substrate through the conductivepatterns formed when at least one terminal of the second electroniccomponents 310 face up (at least one terminal of the first electroniccomponent 320 may face up).

For better configuration of at least one terminal of the firstelectronic component 320 and the second electronic components 310 on thetop surface 320 a of the first electronic component 320, the secondelectronic components 310 are disposed on the center of the top surface320 a of the first electronic component 320, and at least one terminalof the first electronic component 320 is disposed on the periphery ofthe top surface 320 a of the first electronic component 320. In oneembodiment, the first electronic component 320 can have a first terminal(not shown) and a second terminal (not shown); the first terminal isdisposed on a first edge of the top surface 320 a and the secondterminal is disposed on a second edge of the top surface 320 a oppositeto the first edge.

The first electronic component 320 may comprise a cavity (not shown)therein, and the second electronic components 310 can be disposed in thecavity to further decrease the height of the three-dimensional packagestructure. There are many different ways to locate the cavity: in oneembodiment, the cavity is formed inside the first electronic component320; in another embodiment, the cavity is formed with one side alignedwith one edge of the first electronic component 320; in yet anotherembodiment, the cavity is formed with two sides aligned with two edgesof the first electronic component 320 respectively.

For better configuration of at least one terminal of the firstelectronic component 320 and the second electronic components 310 on thetop surface 320 a of the first electronic component 320, the cavity isdisposed in the center of the top surface 320 a of the first electroniccomponent 320, the second electronic components 310 are disposed in thecavity, and at least one terminal of the first electronic component 310is disposed around the cavity. In one embodiment, the first electroniccomponent 320 can have a first terminal (not shown) and a secondterminal (not shown); the first terminal is disposed on a first side ofthe cavity and the second terminal is disposed on a second side of thecavity opposite to the first side.

FIG. 3 c to FIG. 3 e illustrate a schematic diagram of anotherthree-dimensional package structure. The conductive patterns can beextended to the bottom surface 320 b of the first electronic component320 through a plurality of through vias 351 aside the lateral surface320 c of the first electronic component 320 to form a plurality of pads352 disposed on the bottom surface 320 b of the first electroniccomponent 320 or to be electrically connected to a third electroniccomponent 353 disposed on the bottom surface 320 b of the firstelectronic component 320. The through vias 351 can be formed in thefirst insulating material 356 aside the lateral surface 320 c of thefirst electronic component 320. In one embodiment, the first insulatingmaterial 356 can be the same as the second insulating material 333separating the conductive patterns. Preferably, the first insulatingmaterial 356 and the second insulating material 333 can be made of ABF(Ajinomoto Build-up Film). In one embodiment, the first insulatingmaterial 356 can be different from the second insulating material 333separating the conductive patterns. Optionally, the boundary of thefirst insulating material 356 and the second insulating material 333 canalign the top surface 320 a of the first electronic component 320, butit is not limited to this case. Preferably, the first insulatingmaterial 356 can be made of EMC (Epoxy Molding Compound) and the secondinsulating material 333 can be made of ABF (Ajinomoto Build-up Film).

The three-dimensional package structure 300 is generally applied to avoltage regulator module, a power module, a network adapter, a graphicsprocessing unit, a DC/DC converter or a point-of-load (POL) converter.The first electronic component 320 can be a discrete electroniccomponent. The discrete electronic component can be an inductor or anyother electronic component (e.g., capacitor). The inductor can be a LTCC(Low Temperature Co-fired Ceramics) type inductor or any other kind ofinductor. As shown in FIG. 3 b, the top surface 320 a of the firstelectronic component 320 can further comprise a cavity 320 c, and atleast one of the plurality of second electronic components 310 isdisposed in the cavity 320 c to improve the spatial efficiency.

Each of the second electronic components 310 can be a logical controlelement, a driving element or a passive element. The passive element canbe a capacitor, an inductor with lesser inductance, or a resistor. Eachof the second electronic components 310 can also be a power element,such as a metal-oxide-semiconductor field effect transistor (MOSFET), aninsulated gate bipolar transistor (IGBT), a bare die, an IC or a diode.

The plurality of conductive patterns can be formed by thin filmtechnology such as photolithography, sputtering, electroplating orchemical vapor deposition process. The plurality of conductive patternscan also be in multiple layers. As shown in FIG. 4, the plurality ofconductive patterns includes a plurality of via holes 331 and wire layer332. The via holes 331 and wire layer 332 of the plurality of conductivepatterns can provide all required electronic connections. In oneembodiment, the insulating layers uses the ABF (Ajinomoto Build-up Film)333 to combine the first electronic component 320, the plurality ofsecond electronic components 310 and the plurality of conductivepatterns 330 as a whole body. Please note that other insulatingmaterials can be used instead of the ABF (Ajinomoto Build-up Film) 333,and different layers may contain different insulating materials.

In other words, a connecting structure is disposed over the top surfaceof the first electronic component to encapsulate the plurality of secondelectronic components, wherein the connecting structure comprisesconductive patterns, such as the plurality of via holes and wire layers,to electrically connect the plurality of second electronic componentsand the first electronic component and at least one insulting layer,such as the ABF (Ajinomoto Build-up Film), to separate the plurality ofconductive patterns.

In one embodiment, three-dimensional package structure 300 furthercomprises a shielding layer (not shown) disposed in the connectingstructure 330 for EMI-shielding. In one embodiment, an EMC (EpoxyMolding Compound) layer is disposed on the top surface of the firstelectronic component, wherein the plurality of second electroniccomponents and some conductive patterns can be disposed on the EMClayer, wherein the connecting structure 330 can be disposed on the EMC(Epoxy Molding Compound) layer to encapsulate the plurality of secondelectronic components and said some conductive patterns, wherein saidsome conductive patterns can be electrically connected to the conductivepatterns in the connecting structure 330. In one embodiment, at leastone pad can be disposed on the top surface of the connecting structure330 fro connecting to an external PCB board.

With the embodiment of the present invention, the strength andreliability for the connection of wire and components are superior toconventional soldering or wire bonding. Wiring distance can be shortenedto reduce the resistance and improve efficiency; in addition the heightof the whole package structure can be further reduced.

FIG. 4 a to FIG. 4 c illustrate the method and manufacturing process fora three-dimensional package structure according to a first embodiment ofthe present invention. Referring to FIG. 4 a, it shows the step ofproviding a first electronic component 420 having a top surface 420 aand a bottom surface 420 b. The first electronic component 420 can be adiscrete electronic component. The discrete electronic component can bean inductor or any other electronic component (e.g., capacitor). Theinductor can be a LTCC type inductor or any other kind of inductor. Thetop surface 420 a of the first electronic component 420 may expose theelectrodes 421 of the first electronic component 420 for electronicconnections. For mass production and cost down, a plurality of firstelectronic components can be provided simultaneously and arranged in amatrix by a tape (or fixture) (not shown) or an EMC (Epoxy MoldingCompound) (not shown).

Referring to FIG. 4 b, it shows the step of disposing a plurality ofsecond electronic components 410 over the top surface 420 a of the firstelectronic component 420. The first electronic component 420 maycomprise of a cavity (not shown) and at least one of the plurality ofsecond electronic components 410 can be disposed in the cavity tofurther decrease the height of the three-dimensional package structure.In this step, soldering, die attach film, or die bond paste can be usedfor the attachment/positioning of each of the plurality of secondelectronic components 410.

Each of the second electronic components 410 can be a logical controlelement, a driving element or a passive element. The passive element canbe a capacitor, an inductor with lesser inductance, or a resistor. Eachof the second electronic components 410 can also be a power element,such as a metal-oxide-semiconductor field effect transistor (MOSFET), aninsulated gate bipolar transistor (IGBT), and IC or a diode.

Referring to FIG. 4 c, it shows the step of disposing a plurality ofconductive patterns, in a connecting structure 430, over the pluralityof second electronic components 410 to electrically connect theplurality of second electronic components and the first electroniccomponent 420.

The plurality of conductive patterns in the connecting structure 430 canbe formed by thin film technology such as photolithography, sputtering,electroplating or chemical vapor deposition process. The plurality ofconductive patterns in the connecting structure 430 can also be disposedin multiple layers with insulating layers of different types ofmaterials and constructed as different functions. Laser can be used toform a plurality of via holes in the plurality of conductive patterns.The wire layers and conductive material can be disposed by anelectroplating process. The via holes and wire layers of the pluralityof conductive patterns can provide all the required electronicconnections; the insulating layers can use the ABF to combine the firstelectronic component 420, the plurality of second electronic components410 and the plurality of conductive patterns as a whole body. Theplurality of conductive patterns can further include a shielding layer(not shown) for EMI-shielding. The connecting structure 430 can furtherinclude an EMC (Epoxy Molding Compound) (not shown) layer for bonding.

As shown in FIG. 4 c, a cutting process (shown as dash lines) can beincluded to separate single package module from each other.

Second Embodiment

FIG. 5 a to FIG. 5 c illustrate the method and manufacturing process fora three-dimensional package structure according to a second embodimentof the present invention. The difference between this embodiment and thefirst embodiment is that each three-dimensional package structure modulefurther includes at least one discrete electronic component 510 a asidethe first electronic component 520. The conductive patterns 530 lead atleast one terminal of the discrete electronic component 510 a to the topsurface of the three-dimensional package structure for bonding to thecircuit substrate. At least one terminal of the discrete electroniccomponent 510 a can be disposed on the top surface of the discreteelectronic component 510 a. In other words, at least one terminal of thediscrete electronic component 510 a faces the circuit substrate.Referring to FIG. 5 a, it shows the step of providing a first electroniccomponent 520 having a top surface 520 a and a bottom surface 520 b. Thefirst electronic component 520 can be a discrete electronic component.The discrete electronic component can be an inductor or any otherelectronic component (e.g., capacitor). The inductor can be a LTCC typeinductor or any other kind of inductor. The top surface 520 a of thefirst electronic component 520 may expose the electrodes (not shown) ofthe first electronic component 520 for electronic connections. For massproduction and cost down, a plurality of inductors can be providedsimultaneously and arranged in a matrix by a tape (or fixture) 520 c oran EMC (Epoxy Molding Compound) (not shown).

Referring to FIG. 5 b, it shows the step of disposing a plurality ofsecond electronic components 510 over the top surface 520 a of the firstelectronic component, and disposing at least one second electroniccomponents 510 a, such as a capacitor, aside the first electroniccomponent 520. The first electronic component 520 may comprise of acavity (not shown) and at least one of the plurality of secondelectronic components 510 can be disposed in the cavity to furtherdecrease the height of the three-dimensional package structure. In thisstep, soldering/die attach film/die bond paste can be used for theattachment/positioning of each of the plurality of second electroniccomponents 510.

Each of the second electronic components 510, 510 a can be a logicalcontrol element, a driving element or a passive element. The passiveelement can be a capacitor, an inductor with lesser inductance, or aresistor. Each of the second electronic components 510, 510 a can alsobe a power element, such as a metal-oxide-semiconductor field effecttransistor (MOSFET), an insulated gate bipolar transistor (IGBT), andIC, a bare die or a diode.

Referring to FIG. 5 c, the step is to dispose a plurality of conductivepatterns, in a connecting structure 530, over the plurality of discreteelectronic components 510, 510 a to electrically connect the pluralityof discrete electronic components 510, 510 a and the inductor 520.

The plurality of conductive patterns, such as a plurality of via holes531 and wire layers 532, can be formed by thin film technology such asphotolithography, sputtering, electroplating or chemical vapordeposition process. The plurality of conductive patterns can also bedisposed in multiple layers. Laser can be used to form a plurality ofthe via holes 531. The wire layers 532 can be disposed by electroplatingprocess. The via holes 531 and wire layers 532 can provide all requiredelectronic connections; insulating layers, such as the ABF 533, cancombine the first electronic component 520, the plurality of secondelectronic components 510, 510 a and the plurality of conductivepatterns as a whole body. The plurality of conductive patterns canfurther include a shielding layer (not shown) for EMI-shielding. Theconnecting structure 530 can further include an EMC (Epoxy MoldingCompound) (not shown) layer for bonding.

As shown in FIG. 5 c, a cutting process (shown as dash lines) can beincluded to separate single package module from each other. In thepresent invention, the fabrication method is not limited to inductors,but also to inductive components.

It follows from description of the above embodiments that the structurein the present invention and the method for manufacturing the same canoffer many advantages including: 1. Better performance of heatdissipation and electrical conductance. 2. Smaller size by forming theplurality of conductive patterns and using thin film technology andprocess, to connect all the conductive elements by a conductive patternwith extremely thin conductive patterns. 3. Lower cost, compact size andgreat bond strength/reliability.

The above disclosure is related to the detailed technical contents andinventive features thereof. People skilled in this field may proceedwith a variety of modifications and replacements based on thedisclosures and suggestions of the invention as described withoutdeparting from the characteristics thereof. Nevertheless, although suchmodifications and replacements are not fully disclosed in the abovedescriptions, they have substantially been covered in the followingclaims as appended.

1. A three-dimensional package structure, comprising: a first electroniccomponent having a top surface and a bottom surface; a plurality ofsecond electronic components, disposed over the top surface of the firstelectronic component; and a connecting structure disposed over the topsurface of the first electronic component for encapsulating theplurality of second electronic components, the connecting structurecomprising at least one insulting layer and a plurality of firstconductive patterns separated by the at least one insulting layer,wherein the plurality of the first conductive patterns are disposed overthe plurality of the second electronic components for electricallyconnecting the plurality of second electronic components and the firstelectronic component.
 2. The three-dimensional package structureaccording to claim 1, wherein one portion of the plurality of the firstconductive patterns electrically connects at least two of the pluralityof second electronic components.
 3. The three-dimensional packagestructure according to claim 1, wherein the first electronic componentis an inductor.
 4. The three-dimensional package structure according toclaim 2, wherein the inductor is a LTCC (Low Temperature Co-firedCeramics) inductor.
 5. The three-dimensional package structure accordingto claim 1, wherein an insulating layer is disposed on the firstelectronic component so as to form a substantial horizontal surface overthe second electronic components, wherein the plurality of the firstconductive patterns are disposed over the substantial horizontalsurface.
 6. The three-dimensional package structure according to claim5, wherein at least one terminal of the second electronic components isdisposed on the substantial horizontal surface.
 7. The three-dimensionalpackage structure according to claim 5, wherein all terminals of thesecond electronic components are disposed on the substantial horizontalsurface.
 8. The three-dimensional package structure according to claim1, wherein at least one pad is disposed on the top surface of theconnecting structure for connecting to an external circuit.
 9. Thethree-dimensional package structure according to claim 1, wherein thetop surface of the first electronic component comprises a cavity,wherein at least one of the plurality of second electronic components isdisposed in the cavity.
 10. The three-dimensional package structureaccording to claim 1, further comprising at least one third electroniccomponent disposed aside the first electronic component and an EMC(Epoxy Molding Compound) layer encapsulating at least a portion of thefirst electronic component and said at least one third electroniccomponent.
 11. The three-dimensional package structure according toclaim 10, wherein the at least one third electronic component comprisesa capacitor.
 12. The three-dimensional package structure according toclaim 1, wherein each of the plurality of second electronic componentsis a capacitor, a resistor, a diode, a transistor, a bare die or an IC.13. The three-dimensional package structure according to claim 1,wherein each of the at least one insulting layer of the connectingstructure is made of ABF (Ajinomoto Build-up Film).
 14. Thethree-dimensional package structure according to claim 1, furthercomprising an EMC (Epoxy Molding Compound) layer, wherein the EMC (EpoxyMolding Compound) layer is disposed on the top surface of the firstelectronic component, wherein the plurality of second electroniccomponents and a second conductive pattern are disposed on the EMClayer, wherein said second conductive pattern is electrically connectedto the plurality of the first conductive patterns.
 14. (canceled)
 15. Amethod of manufacturing a three-dimensional package structure, themethod comprising the steps of: (a) providing a first electroniccomponent having a top surface and a bottom surface; (b) disposing aplurality of second electronic components over the top surface of thefirst electronic component; and (c) forming a connecting structure overthe top surface of the first electronic component for encapsulating theplurality of second electronic components, the connecting structurecomprising at least one insulting layer and a plurality of conductivepatterns separated by the at least one insulting layer, wherein theplurality of conductive patterns are disposed over the plurality of thesecond electronic components for electrically connecting the pluralityof second electronic components and the first electronic component. 16.The method according to claim 15, wherein the first electronic componentis an inductor.
 17. The method according to claim 15, wherein in step(c) the at least one insulting layer comprises an ABF layer, wherein theABF (Ajinomoto Build-up Film) layer is pressed onto the top surface ofthe first electronic component for encapsulating the plurality of secondelectronic components.
 18. The method according to claim 15, whereinstep (c) comprises a thin film process to create the plurality ofconductive patterns.
 19. A method of manufacturing a plurality ofthree-dimensional packaging module, the method comprising the steps of:(a) providing a plurality of first electronic components on a carrier,wherein each of the plurality of first electronic components has a topsurface and a bottom surface; (b) disposing a plurality of secondelectronic components over the top surface of each of the plurality ofthe first electronic components; (c) forming a plurality of conductivepatterns over the plurality of second electronic components on each ofthe plurality of first electronic component to electrically connect theplurality of second electronic components and the first electroniccomponent; and (d) forming the plurality of the three-dimensionalpackaging module, wherein each three-dimensional packaging modulecomprises a corresponding first electronic component and the pluralityof the second electronic components disposed on the corresponding firstelectronic component, respectively.
 20. The method according to claim19, wherein the carrier comprises at least one of: tape, fixture, orEMC.